Electronic Systems Cooling & Heating: Simulation-Based Thermal Management Design

FEA & CFD Based Simulation Design Analysis Virtual prototyping MultiObjective Optimization

In the design phase of electronic devices, components such as electronic chips, or power systems, the CFD and FEA based heat transfer softwares used to analyze cooling capacity and Simulate conduction and convection in these applications to ensure optimal performance and operation. Enteknograte’s engineering team also model the cooling of heat pipe designs for use in microelectronics or computers. While analyzing electronic cooling, an efficient and accurate simulation is important to avoid malfunction and suboptimal designs.

Electromagnetic Heating

Our engineers use coupled CFD and FEA (based on problem conditions) to model electromagnetic heating at different electromagnetic regimes using an electromagnetics and heat transfer coupling including the effects of Joule heating, inductive heating, and microwave heating effects.
Electronic Systems Cooling & Heating Simulation Thermal Management Design CFD FEA siemens Star-ccm ansys fluent msc cradle
Electronic Systems Cooling & Heating Simulation Thermal Management Design CFD FEA siemens Star-ccm ansys fluent msc cradle 2
Electronic Systems Cooling & Heating Simulation Thermal Management Design CFD FEA siemens Star-ccm ansys fluent msc cradle 3

WE WORK WITH YOU

We pride ourselves on empowering each client to overcome the challenges of their most demanding projects.

Enteknograte offers a Virtual Engineering approach with FEA tools such as MSC Softwrae(Simufact, Digimat, Nastran, MSC APEX, Actran Acoustic solver), ABAQUS, Ansys, and LS-Dyna, encompassing the accurate prediction of in-service loads, the performance evaluation, and the integrity assessment including the influence of manufacturing the components.
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