Electronic Systems Cooling & Heating: Simulation-Based Thermal Management Design
FEA & CFD Based Simulation Design Analysis Virtual prototyping MultiObjective Optimization
In the design phase of electronic devices, components such as electronic chips, or power systems, the CFD and FEA based heat transfer softwares used to analyze cooling capacity and Simulate conduction and convection in these applications to ensure optimal performance and operation. Enteknograte’s engineering team also model the cooling of heat pipe designs for use in microelectronics or computers. While analyzing electronic cooling, an efficient and accurate simulation is important to avoid malfunction and suboptimal designs.
Our engineers use coupled CFD and FEA (based on problem conditions) to model electromagnetic heating at different electromagnetic regimes using an electromagnetics and heat transfer coupling including the effects of Joule heating, inductive heating, and microwave heating effects.
Why we use Coupled FEA-CFD?
Finite Element Analysis (FEA) is a powerful and well recognized tool used in the analysis of heat transfer problems. However, FEA can only analyze solid bodies and, by necessity thermal analysis with FEA is limited to conductive heat transfer. The other two types of heat transfer: convection and radiation must by approximated by boundary conditions. Modeling all three mechanisms of heat transfer without arbitrary assumption requires a combined use of FEA and Computational Fluid Dynamics (CFD).
With using CFD based design optimization solutions serve as an important link for our clients to realize their product promise right from concept to realization. Our team of CFD engineers in conjunction with experienced FEA Engineers for FSI and complicated industrial multiphysics problem is delivering solutions to major engineering verticals globally.
- Conduction, convection and radiative heat transfer
- Conjugate heat transfer
Fluid Structure Interaction for Thermal Analysis
Fluid Structure Interaction (FSI) calculations allow the mutual interaction between a flowing fluid and adjacent bodies to be calculated. This is necessary since all real structures are flexible, especially those that are large or subject to high fluid loads. The body forces generated by fluids flowing are highly sensitive to the shape and curvature of adjacent surfaces.
By coupling a CFD solver and the FEA solver, the deformation of a body resulting from the fluid loads and the subsequent modification of the flow field due to the newly deformed geometry can be computed iteratively. This technique allows aeroelastic instabilities such as flutter, to be detected and avoided early in the design cycle. Similarly, where structures are subjected to cyclic fatigue loading, such as rotor-stator interaction in compressor applications or vortex shedding around civil structures, these load effects can be accurately quantified to allow the fatigue life of the structure to be assessed.
Simulating the thermal performance of a product early in the design phase can save large amounts of time and money by getting the design of the early prototypes right from a thermal management standpoint, thus reducing the need for additional prototypes that might otherwise be required to diagnose and correct thermal issues. Simple computational fluid dynamics (CFD) software can be used to analyze thermal issues such as determining how heat is transferred through a fluid. But many problems are more complex, such as those that involve multiple mechanisms of heat transfer, where heat is transferred through both solids and structures.
Cases in which the fluids and structures involved in heat flow are closely coupled, so that thermal deflection of the structures affects the fluid flow, are also challenging. Engineers often need to understand how heat is transferred by a number of different mechanisms through a complicated interconnected system in order to understand how their product or process will perform under a given set of conditions. This point is one of the applications of FSI simulation with Coupled CFD-FEA method.
As in isolated FEA and CFD one of the most profound benefits of FSI analysis is the ability to conduct comprehensive, multi-point optimization of designs. This process allows us to optimize a design to a given set of performance parameters and can be used to tune frequencies, or maximize fatigue life or avoid harmful resonance.
Equipped with multi-domain knowledge and deep technical expertise, Enteknograte engineering team offers global strategic engineering and environmental consultancy that specializes in performing 1D-Multi-Physics CAE simulations, 3D FEA and CFD thermal analyses and design optimization to a wide variety of clients and industries. Typical applications include:
- PCB Thermal Design
- VTOL, e-VTOL and UAM – Urban Air Mobility Systems Thermal Design
- Electronic Enclosures & Cooling Systems
- Heat Exchanger Design
- Heat Shield & Insulation Design & Optimization
- Underbody and engine compartment thermal protection.
- Brake cooling
- HVAC system performance
- Cabin and passenger thermal comfort
- Defrost and demist
- Thermal comfort in buildings
- Gas turbine cooling
- Heat Transfer in Porous Media
- Turbo machines thermal design
- Combustion and multiphase flows.
- IC Engine flows
- Thermal analysis of radiator with heat pipe