In the design phase of electronic devices, components such as electronic chips, or power systems, the CFD and FEA based heat transfer softwares used to analyze cooling capacity and Simulate conduction and convection in these applications to ensure optimal performance and operation. Enteknograte’s engineering team also model the cooling of heat pipe designs for use in microelectronics or computers. While analyzing electronic cooling, an efficient and accurate simulation is important to avoid malfunction and suboptimal designs.