Ansys HFSS: Multipurpose High Frequency Electromagnetic Field Simulator for RF, Microwave, Advanced Driver Assistance Systems (ADAS), Multipaction, and Electromagnetic Interference and Compatibility (EMI/EMC)

Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, connectors, IC packages and printed circuit boards. Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products.

Ansys hfss Antenna Design Placement Simulation

Smarter Antenna Design and  Placement Simulation

Antennas are virtually everywhere. From commercial applications such as smartphones, RFID tags, and wireless printers, to defense applications such as phased array antennas for aircraft radar systems or autonomous vehicles, to integrated ground-based communication systems. 

Electromagnetic simulation of antenna design and its interaction with the entire system allows designers to evaluate “what if” real life scenarios.




Autonomous Sensor Development: High-Performance Sensor Design for All Conditions

Sensors are critical components that provide the information autonomous vehicles need to make intelligent and safe decisions. They must reliably deliver high performance capabilities and function in a wide range of adverse operating conditions, including rain, ice and snow.

Simulation is proven to enable engineers to improve sensor performance, determine optimal vehicle integration configurations and examine their behavior across a wide range of operational scenarios. With such safety-critical systems, the most accurate, physics-based simulation tools are required. Ansys SPEOS, Ansys AVxcelerate Sensors, and Ansys HFSS provides a comprehensive autonomous vehicle sensor development capability that includes: Lidar, Radar, Camera

Ansys HFSS Multipurpose High Frequency Electromagnetic Field Simulator for RF, Microwave and Wireless Design2
Ansys HFSS Electromagnetic Interference and Compatibility EMI EMC

Electromagnetic Interference and Compatibility (EMI/EMC)

Electronic systems are often safety or mission critical. They form the backbone of global technology disruptions, from 5G-connected devices to autonomous vehicles and the Internet of Things. As performance requirements increase and electronics proliferate, the risk of interference leading to degraded performance, unintended consequences—or even failure—rises dramatically. With using Ansys HFSS, Slwave and EMA3D , EMI/EMC issues can be resolved in advance, with reduced physical testing to deliver high-performance, safe and compliant designs.




PCB Board Modeling and Simulation

Printed circuit boards (PCBs), ICs and IC packages are used in almost all electronic products across all industries: automotive, A&D, consumer electronics, healthcare and energy. With electronics getting smaller, engineers need to design boards that are smaller than ever and incorporate all the required features. Ansys HFSS, Slwave and Icepak enable us to accurate modeling and simulation of these components as the key to reliable end products with SI, PI and EMI Analysis, Electrothermal Analysis, Shock and Vibration Analysis and Reliability Prediction.

PCB Board Modeling and Simulation Ansys HFSS Electromagnetic

EMI/EMC Analysis

Ansys Electronics Desktop enables engineers to easily combine the unmatched accuracy of Ansys electromagnetic 3D and 2.5D field solvers and the powerful circuit- and system-level solutions in Ansys RF Option to diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.
Users can take advantage of the seamless workflow in Electronics Desktop, which includes advanced electromagnetic field solvers, and dynamically link them to power circuit simulators to predict EMI/EMC performance of electrical devices. These integrated workflows avoid repetitive design iterations and costly recurrent EMC certification tests. Multiple EM solvers intended to address diverse electromagnetic problems, as well as the circuit simulators in Electronics Desktop, help engineers assess the overall performance of their electrical devices and create interference-free designs. These diverse problems range from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications.

Radio Frequency Interference (RFI) in Complex Environments

EMIT works hand-in-hand with Ansys HFSS to combine RF system interference analysis with best-in-class electromagnetic simulation for modeling installed antenna-to-antenna coupling. The result is a complete solution to reliably predict the effects of RFI in multi-antenna environments with multiple transmitters and receivers.
EMIT’s powerful analysis engine computes all important RF interactions including non-linear system component effects. Diagnosing RFI in complex environments is notoriously difficult and expensive to perform in a testing environment, but with EMIT’s dynamic linked results views, the identification of the root-cause of any interference is rapidly accomplished via graphical signal trace-back and diagnostic summaries that show the exact origin and path that interfering signals take to each receiver. Once the cause of interference is uncovered, EMIT enables rapid evaluation of various RFI mitigation measures in order to arrive at the optimum solution. The new HFSS/EMIT Datalink allows the model for RFI analysis to be created in EMIT directly from the physical 3D model of the installed antennas in HFSS. This provides a seamless end-to-end workflow for a complete RFI solution for RF environments ranging from large platform cosite interference to receiver desense in electronic devices.

Installed Antenna and RF Cosite Analysis

In Ansys HFSS, engineers can simulate infinite and finite phased-array antennas with all electromagnetic effects, including mutual coupling, array lattice definition, finite array edge effects, dummy elements and element blanking, through advanced unit cell simulation.
A candidate array design can examine input impedances of all elements under any beam scan condition. Phased array antennascan be optimized for performance at the element, subarray or complete array level based on element match (passive ordriven) far-field and near-field pattern behavior over any scan condition of interest. Infinite array modeling involves one or more antenna elements placed within a unit cell. The cell contains periodic boundary conditions on the surrounding walls to mirror fields, creating an infinite number of elements. Element scan impedance and embedded element radiation patterns can be computed, including all mutual coupling effects. The method is especially useful for predicting array-blind scan angles that can occur under certain array beam steering conditions. Finite array simulation technology leverages domain decomposition with the unit cell to obtain a fast solution for large finite-sized arrays. This technology makes it possible to perform complete array analysis to predict all mutual coupling, scan impedance, element patterns, array patterns and array edge effects.

RF Systems and Circuits Analysis

When combined with HFSS, circuits and RF systems simulation technologies create an end-to-end high-performance workflow for RF, EMI/EMC and other applications.
It includes EMIT, a unique multi-fidelity approach for predicting RF system performance in complex RF environments with multiple sources of interference. EMIT also provides the diagnostic tools needed to quickly identify root-cause RFI issues and mitigate problems early in the design cycle.

Signal and Power Integrity Analysis

When combined with HFSS, SI Circuits can be used for analyzing signal integrity, power integrity and EMI issues caused by shrinking timing and noise margins in PCBs, electronic packages, connectors and other complex electronic interconnects.
HFSS with SI Circuits can handle the complexity of modern interconnect design from die-to-die across ICs, packages, connectors and PCBs. By leveraging the HFSS advanced electromagnetic field simulation capability dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a prototype in hardware.

Encrypted 3D Components

Encrypted 3D Component support in HFSS 3D Layout allows companies to share their detailed component designs (connector, antenna, SMD chip capacitor) without divulging IP such as geometry and material properties.
The ability to simulate encrypted HFSS 3D components means that you no longer need to compromise on accuracy. Designers are no longer forced to use circuit-level components (e.g., S-parameter models) vs. true 3D models into their design, impacting the overall simulation accuracy.
It enables prospective customers of vendors to use encrypted 3D Components in a full system design. The end user receives more confidence in the validity of results by rigorously considering coupling effects of the integration while also protecting the vendor’s design IP. In addition, it also provides full, uncompromised simulation fidelity for encrypted 3D components with HFSS and adaptive meshing delivering its gold-standard accuracy.

Multipaction Simulation: Finite-Element Particle-In-Cell (PIC) 

Ansys HFSS has been enhanced with multipaction analysis, which solves for an electronic phenomenon that can cause breakdown due to high electric fields in a vacuum, enhancing solutions for aerospace applications as well as 5G satellites.
HFSS multipaction solver is based on a finite-element particle-in-cell (PIC) method. HFSS provides the multipaction analysis as a postprocessing of the frequency-domain field solutions. With few steps to set up the excitations and boundary conditions for charged particle simulation, you can check whether your design meets the standard for multipaction breakdown prevention.




Multipaction Simulation Finite-Element Particle-In-Cell PIC Ansys HFSS Electromagnetic
Encrypted 3D Components Ansys HFSS Electromagnetic
Radio Frequency Interference (RFI) in Complex Environments Ansys HFSS Electromagnetic
EMI EMC Analysis Ansys HFSS Electromagnetic
RF Systems and Circuits Analysis Ansys HFSS Electromagnetic

Noise, Vibration & Harshness – NVH for Electric Motors

To optimize for NVH, our engineers use the forces from the EM analysis to perform advanced vibro-acoustic simulations. The forces are mapped to evaluate the structural dynamics response of the motor. Modal and harmonic stress coupling responses are important for simulating the NVH of an electric motor and for proper vibro-acoustic design of electric vehicles (EVs). The harmonic analyses generate absolute magnitudes of vibrations and waterfall diagrams to get a complete picture of the motor’s acoustic profile.

Electrical Motor Design

Electromagnetic Finite Element Based Design & Analysis
Our Coupled Electromagnetics, FEA and CFD based multiphysics simulation design provides detailed information about Electrical Motor such as induced voltage, load torque, cogging torque, inductance, flux linkage, iron losses, coil losses, magnet loss, permeance, parameter sensitivity, equivalent circuit model extraction, heat generation, temperature distribution, eccentricity, stress, vibrations, radiated sound, magnetization, demagnetization, and skew effects for different type of motors: Brushless Permanent Magnet machine (BLPM), Induction (or Asynchronous) machine (IM), Wound Synchronous machine (SM), Switched Reluctance machine (SRM), Synchronous Reluctance machine, Permanent Magnet External Rotor.

Power Transformer: Finite Element Based Design

FEA (Finite Element) based Design and simulation enables us to visualization of the phenomena and ease in moving forward with analyzing causes. It also makes possible quantitative evaluations of magnetic saturation, eddy current, induced voltage, stray loss, iron loss, magnetostrictive force, power, efficiency, temperature and the electric fields noise where measurement is difficult.

Electric Motors Cooling

Coupled Electromagnetic Solver with Finite Element & CFD Based Multiphysics simulation
Our FEA and CFD based multiphysics simulation design provides electronics cooling simulation products for chip, package and board thermal analysis as well as thermo-mechanical stress analysis. Multiphysics simulation tools help our customers to enhance reliability of the entire electronic system by managing excessive heat that can otherwise lead to increasing leakage and electromigration failure. Electric motors cooling becomes critical as we want to move to higher power, high-efficiency equipment.

Electromagnetic Multiphysics

With advanced FEA tools we investigate the performance of electromechanical components, energy conversion, design and siting of antennas, electromagnetic compatibility (EMC) and electromagnetic interference (EMI). A range of dedicated solvers (time and frequency based, linear and nonlinear, finite and boundary element) offers a transformative CAE process, with simulations ranging from a fast, initial analysis to inherent realism for final verification.

Ansys Maxwell: Low-Frequency Electromagnetic Simulation for Electric Machines

Ansys Maxwell is an electromagnetic field solver for electric machines, transformers, wireless charging, permanent magnet latches, actuators, and other electromechanical devices. It solves static, frequency-domain and time-varying magnetic and electric fields. Maxwell also offers specialized design interfaces for electric machines and power converters. It includes 3-D/2-D magnetic transient, AC electromagnetic, magnetostatic, electrostatic, DC conduction and electric transient solvers.

Ansys EMA3D Charge/Cable

Electromagnetic Interference, Radiation Ionization Effects, Electrostatic Discharge, Spacecraft Design, Plasma Enhanced Chemical Vapor Deposition (PE-CVD)
The growth in electrification of consumer, industrial and military/aerospace products & systems has led design teams to protect embedded electronics systems against hazards such as ESD (electrostatic discharge) and EMI (electromagnetic interference.) Product developers increasingly turn to simulation tools to capture potential electromagnetic risks earlier in the design process. Unwanted internal and external coupling can prevent or inhibit testing certifications. EMA3D Cable’s capabilities start with: Shielding effectiveness analysis, High Intensity Radiated Fields (HIRF) and cable coupling, EMI crosstalk between cables, Current return network optimization, Cable signal integrity, Lightning and EMP coupling to equipment interfaces

Predict Charged Plasma Behaviors With EMA3D Charge and its Particle-in-Cell Solver

Charged particles and their non-linear discharge characteristics have been especially difficult to model and simulate accurately. Ansys EMA3D Charge provides the capabilities needed to simulate and predict charged plasma behaviors with particle-in-cell (PIC) solver technology. By engaging simulation with the parallelized PIC solver of EMA3D Charge, you can visualize, predict, and monitor plasma behavior accurately and speedily. Not only can you save significantly on the time and cost of current projects, but you can better prepare and design future products through virtual prototyping, predictive accuracy, and EM modeling. You can also model collisions between particles of the same species or between different species.

Battery Thermal Management: Simulation Based Design

Safe, efficient, and cost-effective designs of Electric Vehicles (EVs) batteries become more important. Lithium-ion batteries are the mainstream battery solution for today’s EVs but are sensitive to their operational thermal conditions. Therefore, thermal simulation of these battery packs is paramount in the designing phase, which includes consideration of heat production by battery electro-chemistry, internal resistivity and cooling, EV cooling system, etc.

Simulation of Plasma Based Devices: Microwave Plasma & RF Plasma with Coupling Particle in Cell (PIC), MHD, CFD and FEA Solvers

We provide consulting services for the modeling and simulation of plasma and other flow systems. we combine expertise in physics, Numerical computing, big data processing, automation, and management. Our people are truly motivated experts, passionate about science. Our consulting services utilize our specialized domain expertise in plasma, reactive flows and surface chemistry mechanism development and integration with multi-dimensional flow and plasma systems.

NVH & Acoustics for Hybrid & Electric Vehicles

In NVH Engineering and simulation of Hybrid/Electric Vehicles, the noise from tire, wind or auxiliaries, which consequently become increasingly audible due to the removal of the broadband engine masking sound, should be studied. New noise sources like tonal sounds emerge from the electro-mechanical drive systems and often have, despite their low overall noise levels, a high annoyance rating. Engine/exhaust sounds are often used to contribute to the “character” of the vehicle leads to an open question how to realize an appealing brand sound with EV.

eVTOL (Electric Vertical Take-Off and Landing) & UAM (Urban Air Mobility)

FEA & CFD Based Simulation for Airworthiness Certification, Aerodynamics, Aeroacoustics and Crashworthiness
The VTOL, eVTOL and UAM market is constantly changing and evolving, so maintaining a competitive edge both within the industry and supporting mission effectiveness requires significant research and development activities. Enteknograte offers the industry’s most complete simulation solution for Urban Air Mobility (UAM) and Vertical Take off and Landing (VTOL) aircrafts.

Finite Element Analysis of Durability and Fatigue Life

Vibration Fatigue, Creep, Welded Structures Fatigue, Elastomer and Composite Fatigue with Ansys Ncode, Simulia FE-Safe, MSC CAEFatigue, FEMFAT
Durability often dominates development agendas, and empirical evaluation is by its nature time-consuming and costly. Simulation provides a strategic approach to managing risk and cost by enabling design concepts or design changes to be studied before investment in physical evaluation. The industry-leading fatigue Simulation technology such as Simulia FE-SAFE, Ansys Ncode Design Life and FEMFAT used to calculate fatigue life of multiaxial, welds, short-fibre composite, vibration, crack growth, thermo-mechanical fatigue.

Acoustics and Vibration: FEA and CFD for AeroAcoustics, VibroAcoustics and NVH Analysis

Noise and vibration analysis is becoming increasingly important in virtually every industry. The need to reduce noise and vibration can arise because of government legislation, new lightweight constructions, use of lower cost materials, fatigue failure or increased competitive pressure. With deep knowledge in FEA, CFD and Acoustic simulation, advanced Acoustic solvers and numerical methods used by Enteknograte engineers to solve acoustics, vibro-acoustics, and aero-acoustics problems in automotive manufacturers and suppliers, aerospace companies, shipbuilding industries and consumer product manufacturers.

Integrated Artificial Intelligence (AI) & Machine Learning - Deep Learning with CFD & FEA Simulation

Machine learning is a method of data analysis that automates analytical model building. It is a branch of Artificial Intelligence based on the idea that systems can learn from data, identify patterns and make decisions with minimal human intervention. With Artificial Intelligence (AI) applications in CAE, that is Mechanical Engineering and FEA and CFD Simulations as design tools, our CAE engineers evaluate the possible changes (and limits) coming from Machine learning, whether Deep Learning (DL), or Support vector machine (SVM) or even Genetic algorithms to specify definitive influence in some optimization problems and the solution of complex systems.

Heat Transfer and Thermal Analysis

Fluid-Structure Interaction with Coupled CFD and Finite Element Based Simulation
We analyze system-level thermal management of vehicle component, including underhood, underbody and brake systems, and design for heat shields, electronics cooling, HVAC, hybrid systems and human thermal comfort. Our Finite Element (LS-Dyna, Ansys, Abaqus) and CFD simulation (Siemens Start-ccm+, Ansys Fluent , Ansys CFX and OpenFoam) for heat transfer analysis, thermal management, and virtual test process can save time and money in the design and development process, while also improving the thermal comfort and overall quality of the final product.


We pride ourselves on empowering each client to overcome the challenges of their most demanding projects.

Enteknograte Finite Element Electromagnetic Field simulation solution which uses the highly accurate finite element solvers and methods such as Ansys Maxwell, Simulia CST & Opera, JMAG, Cedrat FLUX, Siemens MAGNET and COMSOL to solve static, frequency-domain, time-varying electromagnetic and electric fields includes a wide range of solution types for a complete design flow for your electromagnetic and electromechanical devices in different industries.