Thermal Stress Simulation: Coupled CFD and Finite Element Approach
FEA & CFD Based Simulation Design Analysis Virtual prototyping MultiObjective Optimization
A good thermal design is the key to optimizing the effect of thermal expansion, either by minimizing or maximizing the effect depending on the case. This phenomenon can be accounted for and studied using the multiphysics coupling method for heat transfer. Thermal expansion is very common and can lead to very high levels of thermal stress. Thermal stress can be positive, such as for shrink fit and bimetallic temperature sensor applications, but it can also be negative. For example, it can negatively affect buildings, thus causing a need for expansion joints, as well as devices subject to high temperature ranges and cyclic thermal loads.
With using advanced thermal analysis technology such as CHT, One way FSI and Two FSI with coupling FEA and CFD software, Enteknograte’s engineering team can predict thermal stress in the structure and use the results for redesign and optimization. This process allows our engineers to optimize a design to a given set of performance parameters and can be used to balance thermal loads, temperature distributions and heat transfer rates to given design targets.
Thermal Cycle Fatigue Simulation
The management of thermal loads and heat transfer is a critical factor in the design of many mechanical products and systems. Enteknograte’s Engineering Team provides a comprehensive Steady-State and Transient CFD Thermal Analysis & Design services using MSC Cradle, Siemens Star-ccm+, OpenFoam and Ansys Fluent Flow Simulation. CFD Thermal Analysis extends the capability of FEA thermal analysis with MSC Nastran, Abaqus and LS-Dyna by replacing the simplistic convection boundary conditions with direct calculations of the heat transfer coefficients based on the fluid flow properties and is often referred to a conjugate heat transfer analysis.
Once the flow solution is complete and the temperature distribution in the solid bodies has been computed then the effects of thermal expansion, thermal stress, fatigue, creep (with Simulia FE-Safe and nCode DesignLife) and thermally induced buckling can be calculated in detail. Effects such as temperature dependent material and fluid properties, contact conditions and other sources of non-linearity can be modeled in detail, regardless of the complexity of the system.
WE WORK WITH YOU
We pride ourselves on empowering each client to overcome the challenges of their most demanding projects.
Enteknograte offers a Virtual Engineering approach with FEA tools such as MSC Softwrae(Simufact, Digimat, Nastran, MSC APEX, Actran Acoustic solver), ABAQUS, Ansys, and LS-Dyna, encompassing the accurate prediction of in-service loads, the performance evaluation, and the integrity assessment including the influence of manufacturing the components.
